Cadence, ASE Group, and Chung Yuan Christian University (CYCU) announced collaboration on an education and training program to cultivate talent for 3D-IC Design. Cadence collaborates with universities on system packaging education and talent development through the Cadence Academic Network program, which provides students with access to Cadence advanced IC packaging design and analysis software. Cadence has collaborated in building a teaching environment that combines the CYCU curriculum with ASE Group’s shared practical experience, which lets students from the Department of Industrial and Systems Engineering (ISE) and other departments learn about Cadence packaging technologies that are prominently used in the workforce.
Amkor has expanded its power solutions for automotive electrification pioneering the utilization of silicon carbide in automotive power packaging. Amkor is one of the first OSATs to provide silicon carbide-based packaging to electric vehicle manufacturers. Amkor includes test and burn-in services for all power solutions giving customers a turnkey solution.
At this year’s CS Mantech, ClassOne applications engineer Farzaneh Sharifi will be hosting an electroplating workshop on May 15 at 10:20AM educating about the intricacies of the plating process as well as innovative approaches to this technology.
ASE’s Dr. Lihong Cao delivered an interesting presentation this week in Japan at the International Conference on Electronics Packaging (ICEP 2023). With focus on advanced packaging, she explored innovation being evolved to meet growing demand for chiplets integration. Lihong will also be at ECTC2023 in Orlando next month,
Cadence demonstrated its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s 3nm (N3E) process technology at the TSMC 2023 North America Technology Symposium this week. This is the latest addition to the Cadence 112G-ELR SerDes IP family.
Aiming to attain carbon neutrality by 2050, Ajinomoto Co., Inc. has started developing a sustainable amino-acid production method with Logomix Inc., a start-up company with a proprietary genome engineering platform called “Geno-Writing™” that modifies various versions of cells and cell systems. By combining Logomix’s genome engineering technology with Ajinomoto Co., Inc.’s technologies and expertise in amino-acid fermentation, the two companies aim to innovate the amino-acid production biocycle by developing sustainable amino-acid production methods that will reduce CO₂ emissions and other environmental impacts in the fermentation process.
Atotech joined Upcell, an Alliance aiming at creating a strong European ecosystem of actors in the battery industry and promoting European innovation in electric battery technology.
AT&S welcomed Austria’s chancellor Karl Nehammer, MSc and Styrian Secretary of Economy Barbara Eibinger-Miedl to AT&S in Leoben where they were able to experience the construction progress of the first European research and production center for IC substrates and gain a 360-degree outlook into what the future holds for the microelectronics industry in Austria.
Vincent Wang, the Vice President and General Manager of Greater China at Onto Innovation, will deliver a welcoming speech at the gala dinner during the International Semiconductor Executive Summits TAIWAN in Taipei on May 9-10.
Finetech announced the Promex purchase of the FINEPLACER® sigma. This is the second FINEPLACER® system implemented by Promex, joining a FINEPLACER® pico system purchased in 2019.
QP Technologies has broadened its plastic package assembly portfolio with the addition of TQFP and MQFP plastic molded packages. These new options offer further flexibility for the mil-aero, automotive, industrial and other cost-sensitive markets that require packaging solutions with high thermal and electrical performance.
KLA has been recognized as one of 2023’s World’s Most Admired Companies by Fortune Magazine.
Ralf Zoberbier, Evatec’s Head of Business Unit Advanced Packaging, will present “Thinfilm Technology for Heat Dissipation Layers in HPC Applications” at ISES Taiwan 2023 on May 9-10.
