ESiPAT-TC Team Prepping for Successful In-Person Event

Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.

This is a great opportunity to meet with members of the SEMI integrated Packaging, Assembly and Test Technology Community (SiPAT-TC), pioneered by the European chapter (ESiPAT-TC) established in 2016. You’ll learn from the seminar presentations, discuss with suppliers and supply chain partners at the exhibition area, actively network and visit a European OSAT company.

The event organizational team is headed by 3D InCites community member ESPAT-Consulting. Its president and founder, Steffen Kröhnert, ESiPAT-TC founder, is a member of the executive committee and is currently vice-chair responsible for strategy, program, promotion, and lobbying work.

The program is set, as are the sponsor/exhibition packages, with more than 50 percent of the sponsor/exhibitor packages already sold. Registration is also now open, and it’s expected to sell out. Due to COVID-19 rules and regulations, a maximum of 120 participants can be accepted.

A line-up of well-known experts in the field will deliver talks and discussions focusing on the hot topics in semiconductor packaging, assembly, and test (SPAT) in Europe. Steffen Kröhnert, ESPAT Consulting, will deliver the keynote in the European Market and Supply Chain session, where he will give an overview on how the role of SPAT has changed over the last 10 years, what counts today – with insides on the current economic and political boundary conditions directing the development – and what will be the future, all complemented with the role of Europe.

Key topics presented