The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D enhanced will be further categorized as 2DS (silicon substrate) or 2DO (organic substrate).
We want to know your opinion. After you vote, please stop by booth 2330 in the South Hall during SEMICON West to pick up your team button!
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Find out more about the new nomenclature here. For more on the heterogeneous integration roadmap, read this interview with Bill Chen.
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