Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip-chip CSPs and BGAs is expected to provide increased volumes this year to help keep foundries and OSATs busy. Few are willing to add foundry, substrate, or assembly capacity for cryptocurrency because of its unpredictability, but many are enjoying the windfall. Cryptocurrency trends are one of the topics in TechSearch International’s latest Advanced Packaging Update.
The latest CSP market forecast shows a 7% CAGR from 2017 to 2022. One of the categories with the strongest growth is the quad flat no-lead (QFN) package with a CAGR of 8.8%. QFNs are a low-cost, low profile package found in a wide range of products from automotive and industrial applications to mobile phones and wearable electronics. An analysis of the OSAT financials is presented. Developments in fifth-generation (5G) wireless broadband technology are discussed including the continued use of 4G LTE and challenges for packaging.
The latest Advanced Packaging Update is a 49-page report with full references and an accompanying set of 52 PowerPoint slides. The report also examines trends in stacked die CSPs and laminate-substrate CSPs. The projected package-on-package (PoP) decline is explained. A five-year market forecast for BGAs is also provided.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 18,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on twitter @Jan_TechSearch
