Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a new license agreement to incorporate ZiBond® and Direct Bond Interconnect (DBI®) technologies into their portfolio of foundry services. This agreement expands Fraunhofer EMFT’s world-class MEMS manufacturing capabilities with the most advanced 3D integration technologies available.
“ZiBond and DBI technologies are truly enabling bonding and 3D integration technologies for next generation electronic products,” said Dr. Peter Ramm, department head, Heterogeneous System Integration at Fraunhofer EMFT. “We look forward to working with Invensas and our global customer base to demonstrate and further optimize these technologies for MEMS applications on our production equipment,” added Prof. Dr. Christoph Kutter, director of Fraunhofer EMFT.
ZiBond and DBI technologies are cost-effective, versatile 2.5D and 3D semiconductor integration solutions that enable leading edge functionality and accelerate time to market for MEMS and multiple other semiconductor products. ZiBond and DBI bonding can be performed at room temperature without requiring bond pressure. Bonding is typically completed in less than a minute for an entire wafer, substantially reducing manufacturing cost.
“Scaling based on Moore’s Law is becoming increasingly challenging and this is driving demand for our ZiBond and DBI bonding and 3D interconnect technologies, which have been proven in high volume production environments,” said Craig Mitchell, president of Invensas Corporation. “We are pleased that Fraunhofer EMFT, a highly respected MEMS research and 3D heterogeneous integration, development and pilot manufacturing center of excellence, has chosen our ZiBond and DBI technologies to help their customers accelerate the development and commercialization of their next generation MEMS products.”
For more information on ZiBond, DBI and other Invensas solutions, please visit www.invensas.com or www.tessera.com.
