MARLBOROUGH, Mass. – Nov. 17, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver plating chemistry has received a prestigious R&D 100 Award, recognizing it as one of the top 100 innovations of the past year. The chemistry joins six other Dow products honored by R&D Magazine at its R&D 100 Awards this year.
SOLDERON BP TS 6000 Tin-Silver plating chemistry eliminates the lead traditionally found in solder used in chip packaging, while improving manufacturing performance with up to twice the productivity and high reliability. The material is optimized for fine-pitch solder bump plating applications, such as Cu pillars and micro-bumps used in 2.5D and 3D-IC packaging technologies. SOLDERON BP TS 6000 Tin-Silver offers a high-performance, lead-free alternative, with benefits such as enhanced plating performance, bath stability and ease of use, thereby enabling the industry’s widest process window with the most robust process flexibility and a competitive cost of ownership.
“It is truly an honor to be recognized as part of this elite list of innovators. This award acknowledges SOLDERON Tin-Silver’s technological significance as a lead-free chemistry that not only creates critical connections in electronic devices, but also enables superior manufacturing productivity with the market’s highest plating speed,” said Jeff Calvert, global R&D director, Advanced Packaging Technologies, Dow Electronic Materials.
Cathie Markham, global R&D director, Dow Electronic Materials, added, “Innovation is paramount to delivering solutions that our customers need, and receiving this honor exemplifies that principle. The scientists who contributed to making these advances possible have collaborated closely with our customers and industry partners to understand and meet their challenges and requirements.”
Dow is proud to recognize its scientists, engineers and marketers who contributed to the development of SOLDERON BP TS 6000 Tin-Silver: Jeff Calvert, Regina Cho, Jin-Sil Choi, Lou Grippo, Masaaki Imanari, Yoon-Joo Kim, Inho Lee, Yil-Hak Lee, Won-Hyun Lee, Sang-Min Park, Jonathan Prange, Yi Qin, Alex Saniuk, Taylor Wang, Julia Woertink, Ju-Mi Yun, Sam Epstein, Scott Shpunt, Kristen Finnemore, Yung-Rai Lee, Jim MacDuff, Willis Martin, Jeff Weber, Brianna Gagnon, Brandon Sherzer and Jianwei Dong.
The annual R&D 100 Awards celebrate only the most significant technology inventions. The Awards were presented at the annual awards gala at Caesars Palace in Las Vegas on Nov. 13, 2015. Sponsored by R&D Magazine, the R&D 100 Awards are known as the Oscars of Invention.
SOLDERON BP TS 6000 Tin-Silver was one of 21 Dow products nominated for a 2015 R&D 100 Award, and one of three finalists from the Dow Electronic Materials division. Each was commercialized in the last year and developed as a market-focused solution, addressing key customer challenges in a more sustainable way. Learn more about Dow’s innovations in science and sustainability.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers to television monitors, smartphones and tablets and other mobile devices as well as electronic devices and systems used in a variety of industries. More information about Dow Electronic Materials can be found at http://www.dowelectronicmaterials.com.
About Dow
Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company is driving innovations that extract value from the intersection of chemical, physical and biological sciences to help address many of the world’s most challenging problems such as the need for clean water, clean energy generation and conservation, and increasing agricultural productivity. Dow’s integrated, market-driven, industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 180 countries and in high-growth sectors such as packaging, electronics, water, coatings and agriculture. In 2014, Dow had annual sales of more than $58 billion and employed approximately 53,000 people worldwide. The Company’s more than 6,000 product families are manufactured at 201 sites in 35 countries across the globe. References to “Dow” or the “Company” mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.
For further information, contact:
Jeremy Cole
+1 508 229 7047
jfcole@dow.com
