This year’s European 3D TSV Summit, January 19-21, 2015, Grenoble France, will focus on how interposers and 3D ICs can help us create smarter systems. To help set the stage, the steering committee engaged a number of influential industry speakers to share their perspectives.
Bryan Black, Senior Fellow, AMD will present new information in his talk, Die Stacking is Happening. From the world of the system-integrator, Timo Henttonen, Senior Manager, Microsoft, will offer his thoughts on The Future or 3D TSVs. And from the assembly and packaging sector, Bill Chen, Fellow and Technical Advisor, ASE will discuss Integrating 3D into the Packaging DNA.
As advanced interposer and 3D IC technologies go into production, the concerns have shifted from technology issues to business-related ones. As such, the steering committee has organized a pre-conference symposium market briefing featuring presentations by four market research organizations that specialize in semiconductor market analysis. Join us Monday, January 19, at 4:00pm, followed by a cocktail reception in the Exhibition hall. Presentations will include:
- The Future of Packaging and Test: Convergence or Coexistence?
Barnett Silver, SVP & Principal, ATREG - From Development to Manufacturing: An Overview of Industry’s 3D Packaging Activities
Rozalia Beica, CTO, Yole Developpement - Gap Analysis: Focus Areas for 3D IC Advancements
Jan Vardaman, President, TeachSearch International - Cost Modeling for 2.5/3D Technologies and Supply Chain Impacts
Scott Jones, Director, AlixPartners
Additionally, a panel discussion moderated by Jean-Christophe Eloy, CEO Yole Développement, will focus on TSV to Products – What Business for 3D Smart Systems?
Panelists include:
- Ron Huemoeller, Senior VP Advanced Product / Platform Development, AMKOR
- Martin Schrems, VP of R&D, ams AG
- Bryan Black, Senior Fellow, AMD
- Mustafa Badaroglu, Senior Program Manager, Qualcomm
The remainder of the program will include presentations from amsAG, Qualcomm, STMicroelectronics, IBM, HP Labs, AMKOR, imec, CEA-LETI, Fraunhofer-IZM, Broadpak, SPTS, EV Group, BESI, Corning, Asahi, Rudolph Technologies, KLA Tencor, Oerlikon Systems, and Fraunhofer IKTS.
Please Join these industry-respected speakers to learn about the latest advances enabling the development of interposer & 3D technology on a marketable scale.
Registration is now open. Sponsorship opportunities are available. Check them out and associate the name of your company to this event. Visit the European 3D TSV Summit website for more information.
Your contact at SEMI:
Yann Guillou
SEMI Grenoble
yguillou@semi.org
+33 4 56 59 30 60
