Tessera Technologies, Inc.and Micron Technology, Inc. announced today the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tessera’s wholly-owned subsidiary Invensas Corporation will license its Multi-Die Face-Down (xFDTM) semiconductor packaging technology to Micron and cooperate with Micron on the manufacturing of Micron products that incorporate xFD technology. As part of the agreements, Tessera and Micron will also explore other possible joint development efforts.
Tessera’s Chief Executive Officer Tom Lacey praised the agreements. “We are delighted to reach new long-term agreements with Micron that build on our existing relationship. We are thrilled to be working closely with one of the most successful and innovative semiconductor companies on the planet,” Lacey said. “We have continued to develop innovative, next-generation technologies that we seek to commercialize with world-class partners like Micron. We look forward to working with Micron to commercialize high performance multi-chip xFD DRAM and other products.”
“We are pleased to reach agreement with Tessera, including a patent license and a technology agreement relating to Tessera’s xFD packaging technology,” said Mark Durcan, Micron’s Chief Executive Officer. “We look forward to discussing further joint development opportunities with Tessera.”
The specific terms and conditions of the agreements are confidential and have not been disclosed by the companies.
