Subscribers are practically blowing up 3D InCites as they duke it out online and race the July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch International, is fast approaching, and we’ve got an exciting program shaping up. We’re happy to report that Qualcomm Inc. has become the Platinum Sponsor, and Mentor Graphics joins FormFactor and Rudolph Technologies as this year’s Silver Sponsors. Proceeds of this event will benefit the Frances B. Hugle Engineering Scholarship, which was established to encourage young women to pursue a career in engineering. The event, hosted by Impress Labs, takes place on July 11, 2012 from 8-10am at the Impress Lounge, located 720 Howard St., San Francisco, CA 94103 above Moscone North.
The guest speaker of this event, Liam Madden, corporate vice president of FPGA Development and Silicon Technology at Xilinx, will give a presentation titled, 3D In Production: Making Chip Stacking a Reality in the FPGA Market, during which he will share Xilinx insights and “lessons learned” on the road to 2.5D and 3D IC commercialization. Madden has responsibility for FPGA design, Advanced Packaging (including 3-D Chip Stacking) and Foundry Technology.
Representing QUALCOMM, Ravi Shenoy, Principal Engineer, QUALCOMM Research, will say a few words prior to the award distribution about why QUALCOMM supports the 3DIC effort. Ravi will join Jan Vardaman, TechSearch International, and me in presenting the awards. And just like the Academy Awards, winners of the 3D InCites Awards will not announced or revealed in advance. The winners will be featured in an online ‘winner’s circle’ on 3D InCites following the event.
A final word: while 90% of the vote is based on the decision of our nine industry expert judges, your opinion matters because 10% of the vote is based on your opinion. You must be registered as a 3D InCites subscriber and logged in to vote. Subscribers can vote once every 24 hours. The online voting concludes Wednesday, July 3.
About our Sponsors and Supporters
Platinum Sponsor for the 2013 3D InCites Awards, Qualcomm Inc. is the world leader in next-generation mobile technologies. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere.
Silver Sponsors for the 2013 3D InCites Awards are Mentor Graphics, Formfactor, and Rudolph Technologies.
Mentor Graphics is a leader in EDA products for electronics and semiconductor companies with solutions that deliver short design cycle time and high productivity. Mentor’s 3D-IC solution extends across the entire design and implementation flow with tools for custom and digital design, extraction and simulation, thermal analysis, physical signoff, design for test and yield analysis. Both interposer (2.5D) and TSV-based designs are fully supported today with design kits and rule decks currently available. Components of the solution include the Pyxis™, Olympus-SoC™, Calibre®, Tessent®, and FlowTHERM® products.
FormFactor Inc. is a leader in advanced wafer test solutions. The company’s advanced wafer probe cards enable semiconductor manufacturers to lower their overall production costs, improve yields, and bring next-generation devices to market. FormFactor’s acquisition of MicroProbe creates the leading wafer test solution provider for both memory and non-memory semiconductor manufacturers. FormFactor is headquartered in Livermore, California with operations in Europe, Asia and North America.
Rudolph Technologies designs, develops, and manufactures defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph tools are used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.
Co-presenter of the 3D InCites Awards, TechSearch International, is the market research leader specializing in technology trends microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe.
Host of the 3D InCites Awards Breakfast, Impress Labs, is a global creative and marketing communications agency specializing in building brands for technology companies in the semiconductor, solar energy and life science industries. The agency’s proprietary CREATING AGENTS™ process helps companies build successful brands. Its unrivalled industry expertise gives it an edge. Impress Labs’ goal is to develop value-based marketing strategies and provide results-driven execution. Your end game is the starting point. Beyond that, Impress Labs creates true engagement, loyalty and long-lasting success for your brand.
