Georgia Tech PRC Proposes Industry Consortium on on 3D ThinPack (THInPack)

Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US, Europe and Asia, has been pioneering ultra-miniaturized electronics by Embedded MEMS, Actives and Passives (EMAP) Technology with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digital, RF, analog, MEMS and sensor functions. GT-PRC has demonstrated groundbreaking technologies that include ultra-thin organic substrates, fine-pitch Cu-to-Cu interconnections, low temperature bonding with high assembly throughput and prototype functional module demonstration of digital Si and RF GaAs die embedding.

GT-PRC proposes the next consortium, building upon the above advances, 3D ThinPack with a focus on:

3D package stacking beyond conventional PoP leading to ultra-thin stacked modules
Ultra-fine pitch and low profile package-to-package interconnections
Novel thermal solutions for embedded thin die eliminating TIM
15µm pitch die-to-package Cu-Cu I/Os with high current carrying capability
Ultra-slim substrates with low warpage
Embedded thin IPDs

The primary objective of the proposed 3D ThinPack consortium is to achieve ultra-miniaturized heterogeneous sub-systems by 3D integration of multiple ultra-slim packages with embedded thin active or passive components. The two-year goal is to demonstrate a four-package stack within ~1mm thickness by advancing the above five technologies shown in Fig 1.

Fig 1: Proposed technologies for ultra-miniaturized 3D stacked modules

The proposed 3D ThinPack research addresses the need for highly-miniaturized and highly-functional heterogeneous modules with particular focus on:

High-yield, low-cost, chip-last embedding with FR4-compatible manufacturing-processes
Interconnections and assembly processes compatible with existing infrastructure

Companies interested in this new industry consortium are encouraged to contact Mr. Nitesh Kumbhat at nitesh@prc.gatech.edu or Prof. Rao Tummala at rao.tummala@prc.gatech.edu.