Ziptronix, Inc. has signed a licensing agreement with Sony Corporation for the use of Ziptronix’s patents regarding oxide bonding technology for backside illumination imaging sensors.
“We believe that Ziptronix’s patented oxide bonding technology, called ZiBond™, enables the industry’s lowest distortion for imaging systems utilizing backside illumination” said Dan Donabedian, CEO of Ziptronix, Inc. “The result is that pixels can be scaled smaller, resulting in more die per wafer. Users of ZiBond™ technology benefit because yields are dramatically
improved and production costs reduced.”
Ziptronix’s patented ZiBond™ technology enables significant advances in digital still cameras, digital video cameras, and cell phone cameras, and also in automotive sensors and projection systems, including pico projectors. Digital cameras, for example, that feature up to five megapixels today will advance to 16 megapixels using Ziptronix’s patented technology. For consumer electronics, this means significant advantages in size reduction, lower power consumption, increased system performance, and better light rendering.
“Our patented bonding technology revolutionizes how light is received in imaging sensors. This is critically important for backside illumination applications,” said Donabedian. “The market for image sensing products is expected to exceed $16 billion cumulative over the next four years. Because ours is an innovative, enabling technology, I expect Ziptronix to play a leadership role in the backside illumination space as well as several other developing markets.”
