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When Plasma Matters
As the company boasts some of the most advanced plasma equipment in the industry, CCO Peter Dijkstra discusses how Trymax...
Talking With Trymax About Innovative Plasma-Based Equipment
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic...
Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size...
IFTLE 408: Plasma Dicing; Intel compares High-density Packaging for HI
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer...Community Members
