SEMICON West 2024 “Stronger Together” Member PreviewJun 25, 2024SEMICON West 2024 is themed Stronger Together. SEMI’s message of...
SEMI Europe 3D & Systems Summit 2024 Community Member PreviewMay 27, 2024The 2024 SEMI Europe 3D & Systems Summit takes place...
ECTC 2024 3D InCites Community Member PreviewMay 13, 20242024 is a big year for 3D InCites members at...
SEMICON West 2024: Riding the Generative AI Winds of Change Jul 15, 2024 · By Francoise von Trapp · Blogs, Francoise in 3D
Sustainability 101: Employee Action Groups for Sustainability Jul 10, 2024 · By Julia Freer Goldstein · Blogs, From Different Dimensions
Chiplet Test: Piecing Together the Next Generation of Chips (Part 2) Jul 09, 2024 · By Erik Jan Marinissen · 3D In-Depth, Test and Inspection
Generative AI Needs Advanced Packaging SolutionsJul 07, 2024The adoption of Generative AI is growing every day. Apple...
Chiplet Interconnect Technology: Piecing Together the Next Generation of ChipsJul 03, 2024Bridging the gap: innovations in chiplet interconnect technology Chiplet interconnects...
An Overview of the Global Semiconductor Secondary Equipment and Parts MarketJul 01, 2024Even though it seems like everything has a computer chip...
June Member News Highlights Semiconductor Design Tools, Collaborations, and MoreJun 26, 2024This June, we’ve seen exciting strides in AI for semiconductor...
IFTLE 597: Samsung Glass Substrates; Samsung SAINTJun 24, 2024Samsung Announced Glass Substrates Effort Samsung Group’s electronics subsidiaries have...
Engineering Smarter 5G Communications Systems FasterMay 28, 2024The massive buildout for 5G communications is just getting underway,...
Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians – Semiconductor DigestJul 15, 2024The program will train facility technician apprentices over the next...
CINDE Promotes Development in Costa Rica at SEMICON West 2024 – Semiconductor DigestJul 10, 2024This is Costa Rica’s first time at SEMICON West, for which CINDE...
Adeia Wins ECTC Award for Paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”Jul 15, 2024SAN JOSE, Calif.—July 10, 2024—Adeia Inc. (Nasdaq: ADEA), a leading...
NY CREATES and SEMI Sign Memorandum of Understanding to Advance Environmental SustainabilityJul 10, 2024Strategic Partnership Aims to Foster New Advancements in Sustainable Initiatives...
SEMI Americas Announces New Annual Event, SEMIEXPO In The Heartland, Focused on Smart Manufacturing and Smart MobilityJul 10, 2024Event partners include the Indiana Economic Development Corporation, the Applied...
Solving the AI PuzzleApr 09, 2024 · By Monita Pau · 3D In-Depth An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential...
Sustainability 101: Strategies for Equipment SuppliersDec 13, 2023 · By Julia Freer Goldstein · Blogs For our industry to fully embrace environmental sustainability, we need the entire supply chain involved. The industry giants can make...
Tracking and Reporting Sustainability: A Stake in the SandOct 23, 2023 · By Dean Freeman · 3D In Context As sustainability matures, the fall of the year seems to be when there is a significant focus on sustainability, culminating...
Who’s Who in China’s AI Chip IndustryFeb 14, 2023 · By Ina Chu · Blogs Since 2015, China’s artificial intelligence (AI) industry has developed rapidly through the promotion of a wide range of technologies. From...
How AI & Machine Learning Are Reshaping the Way Transit Systems Move Traffic PatternsJul 25, 2022 · By Timothy Menard · Blogs Of the many ways artificial intelligence (AI) and machine learning are poised to improve modern life, the promise of impacting...
ML/AI in Semiconductor Packaging and Electronics ManufacturingAug 30, 2021 · By Dr. Dongkai Shangguan · 3D In-Depth As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing....
Autonomous Vehicles Drive AI Advances for Edge ComputingJul 22, 2021 · By Manouchehr Rafie, Ph.D. · 3D In-Depth Advances in Edge Computing Must Innovate for Autonomous Vehicles to Realize Their Potential Large numbers of sensors, massive amounts of...
Before SEMICON West 2020, There was IMEC ITF USA 2020Jul 23, 2020 · By Dean Freeman · 3D Event Coverage Each year as SEMICON West approaches, I look forward to the IMEC ITF USA event. For the past several years...
Big Data and Beyond: PTC Summit Examines AI and ML for Smart City ApplicationsFeb 05, 2020 · By Paul Werbaneth · From Different Dimensions The problem at its most succinct: “A piece of equipment will deteriorate much more predictably than a human body does.”...
IFTLE 437: Packaging Trends for Artificial IntelligenceJan 13, 2020 · By Phil Garrou · Blogs As it has in recent years, SEMICON Europa 2019 featured a dedicated Advanced Packaging Conference. In this and my next...