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The Basics of Chiplet Integration and Importance of Adhesive Solutions
What You Need to Know as an Industry Newcomer If you’re a regular reader of 3D InCites, you’ve probably seen...
IFTLE 570: China Restricts Exports of Gallium and Germanium
Beginning August 1, 2023, China has imposed export restrictions on gallium (Ga) and germanium (Ge) products. These restrictions are seen as...
IFTLE 558: Showa Denko becomes Resonac, Joins Japan’s “Joint 2” Consortium
Let’s begin looking at some of the presentations from the 2023 IMAPS Device Packaging Conference in March. Showa Denko becomes...
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle...
IFTLE 538: Kyocera Details HDBU and HDI Processing and Looks at US On-shoring
As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier this month, IMAPS hosted a...
Cross-disciplinary Experience is Key to Intern Success
As a graduate student in computer science, I was excited to learn about a machine learning internship at Brewer Science....
Materials Science Solutions for Electronics Sustainability
This summer, the temperature reached 111°F in Silicon Valley, where I live. This historical record unmistakably brought home the “inconvenient...
Sustainability 101: Are Your Products Toxic?
Do you know how many individual elements and chemical compounds are required to make a circuit board? I don’t. There...
Development of Innovative Advanced Packaging Materials for System in Package
Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous integration. Different assembly processes are...
IFTLE 497: Ajinomoto Expands Materials Offerings; BESI readies for Chiplet Era
Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto Habib Hichri of Ajinomoto discussed the use of novel...Community Members
