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Send us a text The IEEE MTTS International Microwave Symposium attracts over 9,000 attendees and 500+ exhibitors to share cutting-edge developments in RF, microwave, and advanced packaging technologies. Tim Hancock and Jim Buckwalter from the IMS committee explain why this premier event, taking place in San Francisco’s Moscone Center from June 15-20, has become increasingly […]
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Trump revokes AI Diffusion rule, aiming to simplify policy. Nvidia applauds move. The post Trump Administration Revokes Controversial AI Diffusion Rule appeared first on EE Times.
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Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
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Intel’s historical dominance in semiconductor process technology began to erode around 2018, as competitors started delivering higher performance at smaller nodes. In response, Intel is now doubling down on innovation across two fronts: advanced process nodes such as Intel 18A and 14A, and cutting-edge packaging technologies.… Read More The post Intel’s Foundry Transformation: Technology, Culture, […]
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GaN outshines silicon in RF tech with superior power, thermal performance and efficiency. The post Why RF Technologies Should Consider GaN Over Silicon appeared first on EE Times.
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President Donald Trump has initially excluded semiconductors from his latest round of U.S. tariffs. However, he could put tariffs on semiconductors in the future. If tariffs are placed on semiconductors imported to the U.S., how would that affect U.S.-based semiconductor companies? The chart below shows U.S. semiconductor… Read More The post Semiconductor Tariff Impact appeared […]
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Intel is reportedly planning to cut over 20,000 jobs as part of new CEO Lip-Bu Tan’s push to streamline management, reduce costs, and refocus the company amid ongoing business struggles.
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Send us a text Acoustic inspection stands as a silent sentinel in semiconductor manufacturing, detecting microscopic defects that could lead to catastrophic failures in high-value applications. Bryan Schackmuth, Senior Product Line Manager at Nordson Test and Inspection, reveals how this technology has evolved from laboratory tools to production-line essentials. When ultrasound encounters even the tiniest […]
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Nvidia, AMD begin chip production at TSMC Arizona amid looming U.S. tariffs. The post Nvidia, AMD Ramp at TSMC Arizona as U.S. Tariffs Loom appeared first on EE Times.
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The economics are not yet clear for industrial or consumer electronics. The post Can Chiplets Serve Cost-Conscious Apps? appeared first on Semiconductor Engineering.
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Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year’s award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates • Eric Gongora, […]
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Co-packaged optics and silicon photonics reach an inflection point at this year’s OFC 2025. The post Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025 appeared first on EE Times.
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Trump tariffs, now 54% on Chinese goods, threaten to raise electronics prices. Complex supply chains face disruption, despite some exemptions. The post Trump Tariffs Unleash Shift in Global Economy appeared first on EE Times.
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In response to Trump’s tariffs, China retaliates, including levies and barring American companies and restricting export of minerals. The post China Retaliates Against Trump Tariffs appeared first on EE Times.
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Tariffs on imported automobiles and auto parts are triggering significant volatility into the automotive industry The post Auto Tariffs Send Ripples Across Supply Chains appeared first on EE Times.
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What makes advanced packaging so attractive to some companies, but not others. The post Benefits And Challenges In Multi-Die Assemblies appeared first on Semiconductor Engineering.
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Send us a text The 3D InCites Member Spotlight episode features exclusive conversations with industry leaders at IMAPS Device Packaging Conference 2025, exploring the cutting-edge of semiconductor packaging innovation and domestic manufacturing expansion. • Rex Anderson of Micross details their RESHAPE program funding and Integra acquisition, establishing them as North America’s largest domestic OSAT • […]
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After a slow, five-year build of its first U.S. fab due to labor and logistical hurdles, TSMC now plans to construct future U.S. facilities in two years, but can its timely access to chipmaking equipment remains an uncertainty.
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Semiconductor verification is changing to integrate AI with human expertise. The post The Evolving Role Of AI In Verification appeared first on Semiconductor Engineering.
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Discover Jensen Huang’s take on AI, geopolitics and Nvidia’s evolution beyond a chip company. The post Nine Interesting Thoughts From Jensen Huang appeared first on EE Times.
