Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.
Sustainability 101: Recommitting to the UN SDGs
Last month’s announcement that the United States “rejects and denounces the 2030 Agenda for Sustainable Development and the Sustainable Development Goals” is consistent with the current administration’s isolationist policies. They don’t want to invest any time or money in helping people in other countries, nor do they support the rights...
Innovation Without Borders: Key Takeaways from ISS Europe 2025
Semiconductors have the power to drive technological breakthroughs and fuel geopolitical tensions. As we stand on the precipice of change, the path we choose will define the industry’s future. I recently attended the Industry Strategy Symposium Europe (ISS Europe 2025) in Sopot Poland, hosted by SEMI. This experience gave me...
March Member News: Shaping the Future of Technology
In the month of March, the semiconductor industry saw significant advancements, strategic expansions, and key industry events shaping the future of technology. New innovations in microelectronics, packaging, and automotive systems highlighted the industry’s focus on efficiency and performance. Major acquisitions reinforced the growing emphasis on secure manufacturing and connectivity, while...
The Growing Importance of Advanced Packaging in Europe – Recap of ERS TechTalk
Advanced packaging has emerged as a critical enabler of next-generation applications for artificial intelligence (AI), high-performance computing, wearables, 6G communication, and defense technologies. As traditional scaling approaches face increasing limitations, Advanced packaging enables further miniaturization and improved performance through heterogeneous integration, chip stacking, and high-density interconnects. In Europe, advanced packaging...
Sustainability 101: Making Sense of Sustainability Reporting Requirements
The business news is head-spinning, so it’s understandable that many people feel like they don’t know which way is up. At the risk of publishing something that’s out of date by the time it gets uploaded to the 3D InCites website, I’m going to try to make sense of sustainability...
Industry Trade Shows and Conferences Strengthen Partnerships and Influence Product Innovation
Conferences and industry trade shows have been the cornerstone of professional networking and educational advancement for as long as I can remember. More than 20 years ago, I attended my first semiconductor event, the Solid State Sensors & Actuators Conference (called Hilton Head 2002), and have been participating ever since....
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and notable leadership updates. From breakthrough product launches and major acquisitions to industry collaborations, here’s a look at what our members achieved this month. Technology Innovation and Product Developments Nordson Electronics...
Bridging the Semiconductor Talent Gap – The Role of the European Chips Act and Beyond
The European Chips Act (ECA) is pivotal to Europe’s strategy for technological sovereignty, aiming to strengthen the continent’s semiconductor supply chain and foster innovation. However, a key obstacle remains: the projected shortfall of 350,000 semiconductor professionals by 2030. Addressing this semiconductor talent gap is critical for the ECA’s success and...
What You Need to Know About PFAS
You have probably heard about health and environmental concerns related to per- or polyfluoroalkyl substances (PFAS). Companies are being pressured to replace PFAS with safer alternatives for nonstick coatings, water-resistant fabrics, firefighting foams, and more to meet upcoming restrictions. For manufacturers, including those in the semiconductor industry, PFAS replacement is...
The “White House of Microelectronics Packaging” Celebrates Its 15th Anniversary!
By Juliana Panchenko and Frank Windrich, Fraunhofer IZM-ASSID 15 years ago, Fraunhofer established the “White House of microelectronics packaging”— a leading-edge research center for 3D integration and advanced wafer-level packaging on 200/300mm wafer sizes. It was founded based on visionary ideas in the field of microelectronic packaging from the former...
