Organized and hosted by the Fraunhofer Cluster for 3D Integration, in close collaboration with the Dresden Fraunhofer Cluster Nanoanalysis, this one-day symposium will provide a forum for presenting current research and for discussions on issues related to technology, materials, reliability and characterization for 3D integration, including its applications for novel products. It will partly take place together with the 2015 International Conference on Frontier of Characterization and Metrology for Nanoelectronics (FCMN).
Program Overview:
- 3D IC Analysis and Metrology (1.30-4:00 p.m. // Chair: Martin Gall)
- Valeriy Sukharev (Mentor Graphics)
DFM and DFR requirements for 3D stacked systems to materials data and characterization techniques - Sesh Ramaswami (Applied Materials)
Technology requirement and process control solutions - Jürgen Gluch (TU Dresden/Fraunhofer IKTS)
X-ray tomography for process development and failure analysis - Kris Vanstreels (IMEC)
Analytical challenges and solutions for chip-package interaction - Peter Czurratis (PVA Tepla)
New Scanning Acoustic Microscopy technologies applied to 3D integration applications
- Valeriy Sukharev (Mentor Graphics)
- 3D Cluster Session (4:30-6:00 p.m. // Chair. M.J. Wolf)
- N.N. (details will follow soon)
- Jürgen Wolf (Fraunhofer IZM-ASSID)
3D Integration – Status, Challenges and Requirements - N.N. (details will follow soon)
Participants of the Symposium “3D Integration – Technology, Materials, Reliability” will be invited also to attend the 3rd Dresden Nanoanalysis Symposium on April 17, 2015.
For full details about FCMN 2015, and to register for all or part of the evemts, visit the FCMN 2015 Website
