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SEMICON West 2014: Are 3D ICs Getting the Squeeze?

With the continued innovations in packaging technologies and 2.5D interposers pushing 3D ICs further out from one end, and 16/14nm nodes already qualified without TSVs, making us wait until 10nm, are 3D ICs suddenly getting the squeeze from both sides? That’s one theory I took away from all the conversations...

How will the 450mm Transition Affect Advanced Packaging and 3D ICs?

That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a...

Talking 3D with Manish Ranjan

I’ll never forget the first time I interviewed Manish Ranjan of Ultratech. It was during my first SEMICON West experience in 2006. I was still wet behind the ears, faking my way through most interviews. The easiest ones were with the companies who just wanted to talk about their latest...

3D At Hot Chips, and More

I was on the phone with Herb Reiter yesterday, who told me he’d been busy this week thanks to the Hot Chips Conference (Aug 27-28, Cupertino CA).  I’d been reading about it here and there, but hadn’t made the trip from Phoenix myself. “Should I have been there?” I asked....

When 3D is 3D IC, and When it’s Not

Some of the best news to read (especially on a Friday) is non-news, like this report by Ann Steffora Mutschler, in SemiMD on how 3D ICs will not impact computational lithography tools. According to her sources, this particularly true with regards to TSVs, because of their large size in comparison...

An Incomplete List of 3D Solutions

We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...

Musings From SEMICON West 2012

Tish LeBlanc, from TI: "How's your SEMICON West going? Me: "I was just trying to put it into words." It's Thursday, and another SEMICON West (my seventh) is winding down, and its the first time I've found time to write since Monday evening. As always, it's been a whirlwind of...

Visiting the Valley in 3D

Some people get excited when they go to Hollywood and see famous people.  Not me.  Today, I got positively giddy driving from from San Jose airport to both Invensas and Ultratech’s headquarters.  Oh look! It’s SAMSUNG R&D CENTER! Toshiba! MICRON! I felt that I was in the presence of greatness....

Back by Popular Demand

Once again, I can’t let my follow-up coverage of SEMICON West go by without reporting on my annual briefing with Manish Ranjan, of Ultratech. This year I even got a gift! It was little rubber-like replica of the company’s latest lithography tool that encased a 4G flash drive.  (Those little...

Manish’s Market Moment

For me, SEMICON West is never complete until I’ve had my sit-down with Manish Ranjan of Ultratech. He follows the market, and somehow puts it all into perspective for me, often supporting my own intuition with hard data. Plus he’s a wealth of historical...